AI Data Center
Cooling Design.
Our AI data centers excel with advanced GPUs, liquid cooling, and scalability.
Purpose Built for AI
Our data centers offer a unique selection of hardware optimized for AI applications. Explore the table below to see how TigerDC compares with other data centers.
| Feature | TigerDC | Others |
|---|---|---|
| Hosting Nvidia GPUs | ||
| High-Density Racks (~100 kW) | ||
| Direct-to-Chip Cooling | ||
| InfiniBand Networking for Node Connection | ||
| Easy Scalability | ||
| Future-Proof Design |
Future-Proofed for Tomorrow
Ready for H100s and Blackwell, our data centers are equipped with the latest cooling technologies to handle your growing needs. Get a quick overview of our solutions here.
| Solution | Description | Pro | Con |
|---|---|---|---|
| Single-Phase Direct-to-Chip | Liquid transfers heat to an exchanger | Efficient and easy implementation | ~100 kW rack limit |
| Two-Phase Direct-to-Chip | Phase-changing fluid transfers heat | Highly efficient | Complex, costly |
| Rear Door Cooling | Door removes heat from the rack’s back | Works with direct-to-chip | Limited to air cooling |
| Immersion Cooling | Servers submerged in dielectric liquid | Highest efficiency | High cost, risk of server damage |
Need More Detail?
We've got you covered. Learn more about our cooling solutions below.
Single-Phase Direct-to-Chip
Transfers heat to a circulating fluid
Uses a cold plate
Fluid flows to cooling distribution unit (CDU)
Ideal for AI data centers
Two-Phase Direct-to-Chip
Uses phase change for superior heat absorption
Fluid changes from liquid to vapor
Vapor condenses back in CDU
Ideal for ultra-dense AI data centers
Rear Door Cooling
Utilizes a cooling door for heat management
Installed at the server rack's rear
Contains heat exchangers and fans
Compatible with direct-to-chip systems